
Module CPU Intel 815E ETX — VGA/LAN/Audio
Module CPU Intel 815E ETX — VGA/LAN/Audio. Distribué au Canada et aux États-Unis par IBT Technologies, avec soutien de garantie local et personnalisation d’ingénierie offerte sur demande.
| CPU | Intel Mobile Pentium III / Celeron |
| CPU Front Side Bus | 66/100/133MHz |
| Chipset | Intel 815E Chipset · GMCH: 82815 (544-pin BGA) · ICH2: 82801BA (360-pin BGA) · FWH: 82802AA(4Mb) |
| BIOS | Award 2Mbit Flash BIOS |
| System Memory | One SODIMM socket · Supports to 256MB* PC/100/133 SODIMM modules * Certain 512MB DIMM modules are supported. |
| IDE Interface (on base board) | One enhanced IDE interface supports 2 IDE devices in UDMA/33/66/100, PIO mode 4 and bus master mode |
| LPC I/O | Winbond 83627 for IrDA interface, parallel port, COM ports, FDC, and hardware monitor |
| Parallel Port (on base board) | One parallel port supports SPP/EPP/ECP |
| Serial Ports (on base board) | Two RS-232 ports |
| PCI to ISA Bridge | Winbond 83628 + 83629 |
| ETX Interface | Four connectors for PCI-bus, USB, Audio, VGA, LCD, COM1, COM2, LPT, Floppy, IrDA, Mouse, Keyboard, IDE1, IDE2, Ethernet, ISA |
| Built-in VGA Function | SMI721G8, 8MB VGA memory · One channel 18-bit LVDS |
| Built-in Audio Function | ICH2 Built-in audio · With AC97 Codec STAC9721 · Connectors for Line-out, Line-in, Microphone |
| Ethernet Function | Built in Intel 82801 with Intel 82562E PHY |
| Form Factor | ETX form factor |
| Dimensions | 100mm x 114mm (3.98" x 4.49") |
| Power Requirement | +5V: 5A (for ET815-400, ET815-500) · +5V: 10A (Maximum) |
| Operating Temperature | 0°C~60°C (32°F~140°F) |
| Storage Temperature | -20°C~80°C (-4°F~176°F) |
| Relative Humidity | 10%~90% (non-condensing) |