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RM-F6 Series
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RM-F6 Series

Wide-Temperature SMARC™ 1.0 Module with NXP ARM® Cortex-A9 i.MX 6Dual/6Solo Processor

Wide-Temperature SMARC™ 1.0 Module with NXP ARM® Cortex-A9 i.MX 6Dual/6Solo Processor. Distribué au Canada et aux États-Unis par IBT Technologies, revendeur autorisé IBASE, avec soutien de garantie local et personnalisation d’ingénierie offerte sur demande.

CPU
NXP i.MX 6Dual/6Solo Cortex™-A9 processor with 512KB L2 cache
MEMORY
I-grade 1GB DDR3 on board
DISPLAY
Supports 18/24-bit parallel LCD & LVDS Interface (up to1366 x 768)Supports HDMI interface (1920 x 1080)
ETHERNET
1x GbE LAN
NXP i MX8M based SMARC…SMARC Module
N° DE PIÈCE FABRICANT RM-F6_seriesIBASE Technology · VOIR LA PAGE DU FABRICANT

Specifications

24 LIGNES
Form FactorSMARC™ 1.0
ProcessorNXP i.MX 6Dual/6Solo Cortex™-A9 processor with 512KB L2 cache
System MemoryI-grade 1GB DDR3 on board
Flash MemoryN/A
DisplaySupports 18/24-bit parallel LCD & LVDS Interface (up to1366 x 768)Supports HDMI interface (1920 x 1080)
Video CodecMulti-format HD1080 video Decode and Encode
GraphicsN/A
Audio InterfaceI²S, SPDIF
LAN1x GbE LAN
USB2x USB 2.0 port & 1x USB OTG Interface
Image Capture InterfaceCSI Interface for MIPI camera
Serial Interface4x UART, 1x SPI Interface
Media Interface2x High-speed MMC/SDIO (MMC 8-bit, SDIO 4-bit)
PCI-E1x PCI-E interface
SATA1x SATA 2.0 (Dual only)
GPIO12x GPIO
I²C3x I²C *(4x I²C in F6SO1)
OthersWireless WCN3980 (option)
CAN Bus2x CAN 2.0B
Dimensions82mm x 50mm (3.2" x 2")
EnvironmentHumidity: 0 % to 90 % RH at 60° C (non-condensing)Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis)Vibration: Non-operating: 3Hz to 500Hz, 15 mins
Operating Temperature-40°C ~ +85°C (-40°F ~ 185°F)
OS SupportUbuntu Linux 11.10Android 4.3
CertificationCE/ FCC Class A
§ Apparentés

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