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IBR215L
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IBR215L

SBC Low-Power 2,5 po — NXP i.MX 8M Plus QuadLite - ARM Cortex-A53 Processor

SBC Low-Power 2,5 po — NXP i.MX 8M Plus QuadLite - ARM Cortex-A53 Processor. Distribué au Canada et aux États-Unis par IBT Technologies, revendeur autorisé IBASE, avec soutien de garantie local et personnalisation d’ingénierie offerte sur demande.

CPU
NXP Cortex®-A53 i.MX8M Plus QuadLite processor
MEMORY
3GB DDR4 on board (option: 2/4/8GB)
DISPLAY
HDMI
OPERATING TEMP.
With heat sink or through housing design: -40°C~85°C (-40°F ~185°F)Without heatsink:-40°C~65°C (-40°F ~149°F)
2.5 Disk Size SBCRISC based Single Board…
N° DE PIÈCE FABRICANT IBR215LIBASE Technology · VOIR LA PAGE DU FABRICANT

Specifications

17 LIGNES
Form Factor2.5-inch SBC
ProcessorNXP Cortex®-A53 i.MX8M Plus QuadLite processor
System Memory3GB DDR4 on board (option: 2/4/8GB)
Flash Memory16GB eMMC on board (up to 256GB)
DisplayHDMI
Video CodecN/A
GraphicsOpenGL Es 1.1, 2.0, 3.0,3.1OpenCL 3.0OpenVG 1.1OpenGL 4.0EGL 1.5Vulkan 1.1
Edge I/O1x On/Off button1x 12V~24V DC-in jack1x SD socket (UHS-I SDR-104, 104MB/s max.)1x Boot select switch (boot from eMMC or SD)1x HDMI 1.4a2x USB 3.0 Type-A2x RJ45 GbE LAN1x Mini-USB OTG
Internal I/O1x M.2 B-Key(3052) with SIM socket (for 5G module)2x I2C / 4x GPIO1x Audio Line-in and Line-out1x12V~24V DC-in jack1x DC power (4-pin header)3x IO expansion 2mm pitch 2x20 headers with following features (Contact us for design reference):• 1x USB 2.0• 1x PCM• 2x UART(Rx, Tx)• 1x SDIO• 1x UART (Tx, Rx, CTS, RTS)• 2x USB 3.0• 1x 2ch LVDS with backlight control• 1x I2C• 2x PWM• 3x GPIO• 1x Cap touch IF• 2x MIPI-CSI for
Expansion IO1x M.2 E-Key(2230)w/ SDIO, UART for wireless1x Mini PCI-E w/ USB 2.0, SIM, PCM for 4G/LTE1x DB-9 RS232/422/485 port2x USB 3.0 in 1x19-pin headers1x 2ch LVDS with backlight control1x Cap touch IF2x MIPI-CSI2x CAN-FD
Watchdog256 levels, 0~128 seconds
DimensionsIBR215L: 105mm(W) x 72mm(D)4.13”(W) x 2.83”(D)IBR215-IO: 100mm(W) x 72mm3.94”(W) x 2.83”(D)IBR215L+IBR215-IO: 105mm(W) x 72mm(D) x 35mm(H)4.13”(W) x 2.83”(D) x 1.37”(H)
Power Input12V~24V DC-in jack
Operating TemperatureWith heat sink or through housing design: -40°C~85°C (-40°F ~185°F)Without heatsink:-40°C~65°C (-40°F ~149°F)
Relative Humidity10%~90% (non-condensing)
OS SupportYocto 5.0Android 11Other OS (by request)
CertificationCE/ FCC Class-B
§ Apparentés

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