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ET815
EMBEDDED MODULES / IN STOCK

ET815

Intel 815E ETX CPU Module with VGA/LAN/Audio

Intel 815E ETX CPU Module with VGA/LAN/Audio. Supplied across Canada and the United States by IBT Technologies, with local warranty support and engineering customization available on request.

CPU
Intel Mobile Pentium III / Celeron
MEMORY
One SODIMM socket · Supports to 256MB* PC/100/133 SODIMM modules * Certain 512MB DIMM modules are supported.
STORAGE
-20°C~80°C (-4°F~176°F)
ETHERNET
Built in Intel 82801 with Intel 82562E PHY
Legacy catalogueIBASE Technology
MFR. PART # ET815IBASE Technology

Specifications

20 ROWS
CPUIntel Mobile Pentium III / Celeron
CPU Front Side Bus66/100/133MHz
ChipsetIntel 815E Chipset · GMCH: 82815 (544-pin BGA) · ICH2: 82801BA (360-pin BGA) · FWH: 82802AA(4Mb)
BIOSAward 2Mbit Flash BIOS
System MemoryOne SODIMM socket · Supports to 256MB* PC/100/133 SODIMM modules * Certain 512MB DIMM modules are supported.
IDE Interface (on base board)One enhanced IDE interface supports 2 IDE devices in UDMA/33/66/100, PIO mode 4 and bus master mode
LPC I/OWinbond 83627 for IrDA interface, parallel port, COM ports, FDC, and hardware monitor
Parallel Port (on base board)One parallel port supports SPP/EPP/ECP
Serial Ports (on base board)Two RS-232 ports
PCI to ISA BridgeWinbond 83628 + 83629
ETX InterfaceFour connectors for PCI-bus, USB, Audio, VGA, LCD, COM1, COM2, LPT, Floppy, IrDA, Mouse, Keyboard, IDE1, IDE2, Ethernet, ISA
Built-in VGA FunctionSMI721G8, 8MB VGA memory · One channel 18-bit LVDS
Built-in Audio FunctionICH2 Built-in audio · With AC97 Codec STAC9721 · Connectors for Line-out, Line-in, Microphone
Ethernet FunctionBuilt in Intel 82801 with Intel 82562E PHY
Form FactorETX form factor
Dimensions100mm x 114mm (3.98" x 4.49")
Power Requirement+5V: 5A (for ET815-400, ET815-500) · +5V: 10A (Maximum)
Operating Temperature0°C~60°C (32°F~140°F)
Storage Temperature-20°C~80°C (-4°F~176°F)
Relative Humidity10%~90% (non-condensing)
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