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North America
ASB210-966
EMBEDDED SYSTEMS / IN STOCK

ASB210-966PRELIMINARY

Compact System with IB966 motherboard

Compact system based on the IB966 motherboard. Local warranty support and engineering customization available on request.

CPU
3rd Generation Intel® Mobile Core™ i7/i5/i3/ Celeron® QC/ DC processors
MEMORY
1x DDR3 SO-DIMM, Max. 8GB (Non-ECC)
STORAGE
1x mSATA
OPERATING TEMP.
0°C~45°C (32°F~113°F) *with airflow 0.9m/s
ASB Series Fanless SystemSBC System
P/N # ASB210-966

Specifications

14 ROWS
System MainboardIB966
CPU Type3rd Generation Intel® Mobile Core™ i7/i5/i3/ Celeron® QC/ DC processors
CPU SocketFCPGA988
ChipsetIntel® QM77 PCH
Memory1x DDR3 SO-DIMM, Max. 8GB (Non-ECC)
LAN1x Intel® 82579 Gigabit LAN controller
Storage1x mSATA
Chassis ColorBlack
MountingDesktop or wall mount (wall mount kit included)
Dimensions127mm (W) x 75.4mm (D) x 180mm (H) 5.0" (W) x 2.97" (D) x 7.09" (H)
Operating Temperature0°C~45°C (32°F~113°F) *with airflow 0.9m/s
Storage Temperature-20°C ~80°C (-4°F~176°F)
Relative Humidity5%~90%@45°C (non-condensing)
CertificationCE/LVD/FCC Class-B