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IB113

SBC à large plage de température à base ARM — NXP i.MX6 Cortex-A9 Dual Core 800MHz Automotive Grade CPU Risc Platform

SBC à large plage de température à base ARM — NXP i.MX6 Cortex-A9 Dual Core 800MHz Automotive Grade CPU Risc Platform. Distribué au Canada et aux États-Unis par IBT Technologies, avec soutien de garantie local et personnalisation d’ingénierie offerte sur demande.

CPU

NXP Cortex™-A9 i.MX6 Dual 800MHz, automotive grade CPU

MEMORY

1GB DDR3 on board

DISPLAY

HDMI · 18/24 bit dual channel LVDS (up to 1920 x 1080)

ETHERNET

1st LAN: 10/100/1000 Base-T Ethernet (Gb LAN)

Legacy catalogueIBASE Technology

DEMANDER UNE SOUMISSION DEMANDER LA FICHE TECHNIQUE

N° DE PIÈCE FABRICANT IB113 — IBASE Technology

Specifications

24 LIGNES

Form Factor	3.5" Disk-Size SBC
CPU	NXP Cortex™-A9 i.MX6 Dual 800MHz, automotive grade CPU
System Memory	1GB DDR3 on board
Data Memory	4GB eMMC on board · SD socket (up to 32GB)
Display	HDMI · 18/24 bit dual channel LVDS (up to 1920 x 1080)
Video Codec	Decode: 1080p, 30fps
Encode	1080p, 30fps
LAN	1st LAN: 10/100/1000 Base-T Ethernet (Gb LAN)
2nd LAN	10/100 Base-T Ethernet
Touch	PM6000 resistive touch IC (4/5-wires) on board
USB	I²C header on board (for capacitive touch)
Audio	Audio pin header (1x microphone, 1x speaker)
RTC	Seiko RTC IC on board
Watchdog	256 Levels
Edge I/O	1x 2nd 10/100 LAN · 1x USB 2.0 Host (Type-A) · 1x USB OTG (mini-USB Type-B) · 1x COM RS-232/422/485 · 1x SD socket (up to 64GB) · 1x DC-in jack · 1x HDMI (Type-A) · 1x Reset button
Headers and Expansion Slots	Headers: · 8x GPIO pin header · 1x Debug port pin header · 1x USB2.0 Host box header · 1x I²C pin header · 1x 4/5-wire resistive touch pin header · 2x CAN Bus 2.0B (w/ isolation) pin headers · 1x Dual channel LVDS box header (supports full HD) · 1x Audio pin header (1x microphone, 1x speaker) · 1x SATA header
Slots	1x Full-size Mini PCI-E with USB interface
Power	12V~24V DC-in
Dimensions	102mm x 147mm (4” x 5.8”)
Devices	WIFI/BT/3G+GPS moduel (option)
Software Support	Ubuntu Linux 12.04(kernel 3.0.35)/ Android 4.3
Operating Temperature	-40°C~ 85°C (-40°F ~ 185°F)
Relative Humidity	10%~90% (non-condensing)
Certification	CE/FCC Class A

Features

8 LIGNES

Feature 1	NXP ARM Cortex-A9, i.MX6 Dual 800Mhz, automotive-grade processor
Feature 2	Supports -40°C~ 85°C environment, all industrial-grade components
Feature 3	Supports 12V~24V DC input voltage
Feature 4	1GB DDR3, 4GB eMMC on board
Feature 5	Supports resistive touch panel (4/5-wires) and capacitive touch interface
Feature 6	Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators
Feature 7	Supports COM, CAN bus, USB-OTG, SD card, HDMI, dual channel LVDS
Feature 8	Supports rich I/O interface for BOM customization

Ordering Information

4 LIGNES

IB113	-
IB113A	- 3.5-inch SBC w/ automotive-grade NXP i.MX6 solo core (800Mhz), 1GB DDR3, 1x LAN , SD, 1x COM ports, Mini PCI-E(x1) slot, LVDS, HDMI, 8x GPIO, 4GB eMMC
HSIB113-BGA-B	- Heatsink for IB113
HSIB113-BGA-A	- Heatsink for IB113A

IB113

Specifications

Features

Ordering Information

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