CANADA · NORTH AMERICA
IB113
SINGLE BOARD COMPUTERS / IN STOCK

IB113

ARM-Based Wide Temperature SBC with NXP i.MX6 Cortex-A9 Dual Core 800MHz Automotive Grade CPU Risc Platform

ARM-Based Wide Temperature SBC with NXP i.MX6 Cortex-A9 Dual Core 800MHz Automotive Grade CPU Risc Platform. Supplied across Canada and the United States by IBT Technologies, with local warranty support and engineering customization available on request.

CPU
NXP Cortex™-A9 i.MX6 Dual 800MHz, automotive grade CPU
MEMORY
1GB DDR3 on board
DISPLAY
HDMI · 18/24 bit dual channel LVDS (up to 1920 x 1080)
ETHERNET
1st LAN: 10/100/1000 Base-T Ethernet (Gb LAN)
Legacy catalogueIBASE Technology
MFR. PART # IB113IBASE Technology

Specifications

24 ROWS
Form Factor3.5" Disk-Size SBC
CPUNXP Cortex™-A9 i.MX6 Dual 800MHz, automotive grade CPU
System Memory1GB DDR3 on board
Data Memory4GB eMMC on board · SD socket (up to 32GB)
DisplayHDMI · 18/24 bit dual channel LVDS (up to 1920 x 1080)
Video CodecDecode: 1080p, 30fps
Encode1080p, 30fps
LAN1st LAN: 10/100/1000 Base-T Ethernet (Gb LAN)
2nd LAN10/100 Base-T Ethernet
TouchPM6000 resistive touch IC (4/5-wires) on board
USBI²C header on board (for capacitive touch)
AudioAudio pin header (1x microphone, 1x speaker)
RTCSeiko RTC IC on board
Watchdog256 Levels
Edge I/O1x 2nd 10/100 LAN · 1x USB 2.0 Host (Type-A) · 1x USB OTG (mini-USB Type-B) · 1x COM RS-232/422/485 · 1x SD socket (up to 64GB) · 1x DC-in jack · 1x HDMI (Type-A) · 1x Reset button
Headers and Expansion SlotsHeaders: · 8x GPIO pin header · 1x Debug port pin header · 1x USB2.0 Host box header · 1x I²C pin header · 1x 4/5-wire resistive touch pin header · 2x CAN Bus 2.0B (w/ isolation) pin headers · 1x Dual channel LVDS box header (supports full HD) · 1x Audio pin header (1x microphone, 1x speaker) · 1x SATA header
Slots1x Full-size Mini PCI-E with USB interface
Power12V~24V DC-in
Dimensions102mm x 147mm (4” x 5.8”)
DevicesWIFI/BT/3G+GPS moduel (option)
Software SupportUbuntu Linux 12.04(kernel 3.0.35)/ Android 4.3
Operating Temperature-40°C~ 85°C (-40°F ~ 185°F)
Relative Humidity10%~90% (non-condensing)
CertificationCE/FCC Class A

Features

8 ROWS
Feature 1NXP ARM Cortex-A9, i.MX6 Dual 800Mhz, automotive-grade processor
Feature 2Supports -40°C~ 85°C environment, all industrial-grade components
Feature 3Supports 12V~24V DC input voltage
Feature 41GB DDR3, 4GB eMMC on board
Feature 5Supports resistive touch panel (4/5-wires) and capacitive touch interface
Feature 6Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators
Feature 7Supports COM, CAN bus, USB-OTG, SD card, HDMI, dual channel LVDS
Feature 8Supports rich I/O interface for BOM customization

Ordering Information

4 ROWS
IB113-
IB113A- 3.5-inch SBC w/ automotive-grade NXP i.MX6 solo core (800Mhz), 1GB DDR3, 1x LAN , SD, 1x COM ports, Mini PCI-E(x1) slot, LVDS, HDMI, 8x GPIO, 4GB eMMC
HSIB113-BGA-B- Heatsink for IB113
HSIB113-BGA-A- Heatsink for IB113A
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